The IMAPS Flash Conference 2025 invites submissions of abstracts in the following categories. We seek cutting-edge research and applications in microelectronics packaging, including advanced technologies, reliability, quantum devices, and sustainability. The official language of the conference is English. If you exceptionally choose to present in Czech, your presentation slides must be in English. All students are required to present in English.
Chariman of flash poster session: Ing. Alexandr Otáhal, Ph.D.
1. Theoretical Approaches (Modelling, simulation, conceptual frameworks)
1.1 Thermal Modeling and Reliability Prediction in Power Modules
1.2 Electromagnetic Simulation for High-Speed and Optical Interconnects
1.3 Substrate and Dielectric Property Simulation for RF and Quantum Applications
1.4 Design of Electronic Circuits and Layouts for Advanced Packaging (Routing, power/signal integrity, parasitics, cross-domain co-design, EDA tools for heterogeneous integration)
2. Applications (System-level use, market-driven deployment, functional integration)
2.1 Advanced Packaging in Automotive (ADAS, Powertrain, Safety Systems)
2.2 Packaging for AI, Edge, and HPC Systems
2.3 Photonic and Optical Packaging for Datacenters & Telecom
2.4 MEMS and Sensor Packaging in Biomedical and Industrial Systems
2.5 Quantum Devices and Systems (Qubit Control, Photonics, Cryo Integration)
2.6 Sustainable Electronics and Circular Economy Packaging
3. Enabling Technologies (Materials, processes, interconnects, testing)
3.1 Chiplet & Interposer Technologies (2.5D/3D, RDL, TSV)
3.2 SiC / GaN Packaging and High-Power Integration
3.3 Thermal Management: TIMs, Spreaders, Heat Dissipation
3.4 Electrical Interconnects: Flip-Chip, Wirebond, Sintering
3.5 Optical Assembly and Co-Packaged Optics Technologies
3.6 High-Performance Substrates (ABF, Organic, Glass)
3.7 Failure Analysis and Reliability Testing (FIB, SAM, X-ray, HALT)
3.8 Cryogenic Packaging and Low-Temperature Materials
3.9 Eco-Friendly Materials and Low-Energy Manufacturing