IMAPS flash Conference 2025 “Quantum meets silicon”, organized by International Microelectronics and Packaging Society Czech and Slovak Chapter (IMAPS CZ&SK), Brno University of Technology (BUT) and Institute of Scientific Instruments (ISI).
Accepted fullpapers will be published in a special issue of the Precision Mechanics and Optics (JMO). Template: templateJMO
Date: 23 – 24. October 2025
Place: Institute of Scientific Instruments of the Czech Academy of Sciences, Královopolská 147, 612 00 Brno-Královo Pole
General chairman: doc. Ing. Alexandr Knápek, Ph.D.
Chariman of flash poster session: Ing. Alexandr Otáhal, Ph.D.
Abstract (Conference Abstract Book) – deadline extended 01.09. 2025
Registration – deadline extended 01.09. 2025
Conference – 23 – 24.10. 2025
Poster format: A0, Conference logo: Logo
Full paper (Special issue in: https://jointlab.upol.cz/jmo/) – 15.11. 2025 – Submission will be available after conference. Template: templateJMO
Texts for JMO can be prepared in Microsoft Word or LaTex, text in English. Images are required as separate files, if possible CMYK and in sufficient resolution, graphs preferably as vector graphic files. The text should contain the names of the authors, title, abstract, keywords, a list of the literature you refer to. In the case of an English contribution, translate the title, abstract and keywords into Czech. At the end of the contributions, the full names of the authors with titles, workplace address and e-mail address of at least one (corresponding) author, or a telephone connection, are given. Choose a reasonable range and number of images, both are essentially unlimited. For writing mathematical expressions, scalar variables (also as indices) are put in italics, vectors, matrices, functions, constants pi, e, differential d, imaginary unit in bold.
The IMAPS Flash Conference 2025 invites submissions of abstracts in the following categories. We seek cutting-edge research and applications in microelectronics packaging, including advanced technologies, reliability, quantum devices, and sustainability. The official language of the conference is English. If you exceptionally choose to present in Czech, your presentation slides must be in English. All students are required to present in English.
1. Theoretical Approaches (Modelling, simulation, conceptual frameworks)
1.1 Thermal Modeling and Reliability Prediction in Power Modules
1.2 Electromagnetic Simulation for High-Speed and Optical Interconnects
1.3 Substrate and Dielectric Property Simulation for RF and Quantum Applications
1.4 Design of Electronic Circuits and Layouts for Advanced Packaging (Routing, power/signal integrity, parasitics, cross-domain co-design, EDA tools for heterogeneous integration)
1.5 Other Theoretical Approaches
2. Applications (System-level use, market-driven deployment, functional integration)
2.1 Advanced Packaging in Automotive (ADAS, Powertrain, Safety Systems)
2.2 Packaging for AI, Edge, and HPC Systems
2.3 Photonic and Optical Packaging for Datacenters & Telecom
2.4 MEMS and Sensor Packaging in Biomedical and Industrial Systems
2.5 Quantum Devices and Systems (Qubit Control, Photonics, Cryo Integration)
2.6 Sustainable Electronics and Circular Economy Packaging
2.7 Other Applications
3. Enabling Technologies (Materials, processes, interconnects, testing)
3.1 Chiplet & Interposer Technologies (2.5D/3D, RDL, TSV)
3.2 SiC / GaN Packaging and High-Power Integration3.3
3.3 Thermal Management: TIMs, Spreaders, Heat Dissipation
3.4 Electrical Interconnects: Flip-Chip, Wirebond, Sintering
3.5 Optical Assembly and Co-Packaged Optics Technologies
3.6 High-Performance Substrates (ABF, Organic, Glass)
3.7 Failure Analysis and Reliability Testing (FIB, SAM, X-ray, HALT)
3.8 Cryogenic Packaging and Low-Temperature Materials
3.9 Eco-Friendly Materials and Low-Energy Manufacturing
3.10 Passive Components
3.11 Other enabling technologies
Submission
Abstract (Conference Abstract Book) – deadline extended 01.09. 2025
IMAPS flash Conference abstract template is downloadable in this link: Abstract template
Prospective authors are kindly asked to submit their abstract in word type document (2 pages A4 including text, 2 figures and 5 references – please use abstract template) below: