IMAPS flash Conference 2026 “Advanced Semiconductor Metrology”, organized by International Microelectronics and Packaging Society Czech and Slovak Chapter (IMAPS CZ&SK), Brno University of Technology (BUT), Institute of Scientific Instruments (ISI) and Tomas Bata University (TBU).

Accepted fullpapers will be published in a special issue of the Precision Mechanics and Optics (JMO). Template: templateJMO

Date: …….

Place: 

General chairman: doc. Ing. Alexandr Knápek, Ph.D.

Chariman of flash poster session: Ing. Alexandr Otáhal, Ph.D.

Abstract (Conference Abstract Book) – 

Registration – 

Conference – 

Poster format: A0, Conference logo: Logo

Full paper (Special issue in: https://jointlab.upol.cz/jmo/) Submission will be available after conference. Template: templateJMO

 

Texts for JMO can be prepared in Microsoft Word or LaTex, text in English. Images are required as separate files, if possible CMYK and in sufficient resolution, graphs preferably as vector graphic files. The text should contain the names of the authors, title, abstract, keywords, a list of the literature you refer to. In the case of an English contribution, translate the title, abstract and keywords into Czech. At the end of the contributions, the full names of the authors with titles, workplace address and e-mail address of at least one (corresponding) author, or a telephone connection, are given. Choose a reasonable range and number of images, both are essentially unlimited. For writing mathematical expressions, scalar variables (also as indices) are put in italics, vectors, matrices, functions, constants pi, e, differential d, imaginary unit in bold.

The IMAPS Flash Conference 2025 invites submissions of abstracts in the following categories. We seek cutting-edge research and applications in microelectronics packaging, including advanced technologies, reliability, quantum devices, and sustainability. The official language of the conference is English. If you exceptionally choose to present in Czech, your presentation slides must be in English. All students are required to present in English.

 

TOPIC OF THE CONFERENCE

1. Electronic Assembly, Packaging & Advanced Integration

  •  Microelectronics assembly and manufacturing processes
  •  Electronic and semiconductor packaging technologies
  •  Advanced, heterogeneous and 3D integration (2.5D/3D, chiplets)
  •  Substrates, interposers and wafer-level / system-level packaging
  •  Design for Manufacturing (DfM) and Design for Assembly (DfA)

2. Joining, Interconnection & Interface Technologies

  • Soldering processes and solder materials
  • Die attach, chip bonding and hybrid joining technologies
  • Interconnection architectures and contact technologies
  • Interface engineering, intermetallic formation and degradation
  • Reliability of joints, bonds and interconnects

3. Materials & Functional Structures for Microelectronics

  • Structural and functional materials for microelectronics
  • Thin films, coatings and nanostructured materials
  • Conductive, resistive, dielectric and magnetic materials
  • Materials for sensors, emitters, photonics and quantum devices

4. Simulation, Modelling & Digital Design Tools

  •  Multiphysics simulation and numerical modelling
  •  Thermo-mechanical behaviour, stress, warpage and thermal management
  •  Electrical, physical and device-level modelling
  •  Digital design tools, simulation frameworks and workflows
  •  FPGA-based systems, hardware description, modelling and co-design

5. Reliability, Testing & Characterization

  •  Reliability engineering and lifetime prediction
  •  Electrical, mechanical, thermal and environmental testing
  •  Failure analysis, root cause analysis and defect diagnostics
  •  Advanced and in-situ characterization techniques

6. Sensors, Microsystems, Embedded & Control Systems

  •  Sensor technologies and microsystems (MEMS/NEMS)
  •  Gas, chemical, optical and physical sensors
  •  Embedded systems and hardware–software co-design
  •  Control systems, signal processing and real-time architectures
  •  Integration of sensors and embedded electronics

7. Quantum, Photonics & Future Semiconductor Technologies

  •  Quantum technologies, quantum materials and devices
  •  Silicon-based and hybrid quantum systems
  •  Integrated photonics and optoelectronics
  •  Advanced emitters, detectors and photonic structures
  •  Future trends in semiconductor devices, systems and industry

 

IMAPS flash Conference abstract template is downloadable in this link: Abstract template

Prospective authors are kindly asked to submit their abstract in word type document (2 pages A4 including text, 2 figures and 5 references – please use abstract template) below: