We are pleased to invite you to the IMAPS Flash Conference 2026, organized by the Czech and Slovak Chapter
of the International Microelectronics and Packaging Society (IMAPS CZ&SK), in partnership with Tomáš Baťa
University in Zlín.
IMAPS Flash Conference is the European forum for the exchange of information between senior and young scientists
from academic institutions and the electronics industry. The focus is on sharing experimental and theoretical work
across the broad fields of electronics, microelectronic technology, and packaging.
Building on last year’s successful format, the conference once again features a flash poster session, providing an open
platform for discussion and exchange of ideas. In addition, the conference will focus on a special thematic area,
“Comprehensive Semiconductor Analysis”, reflecting the growing importance of integrated and cross-disciplinary
approaches in semiconductor research.
Date: October 22–23, 2026
Venue: Univerzita Tomáše Bati ve Zlíně,
Fakulta aplikované informatiky, Nad Stráněmi 4511, 760 05 Zlín
Conference Chair: doc. Ing. Milan Navrátil, Ph.D.
Website: https://cz.imapseurope.org/
Abstract submission deadline: 1st of June 2026