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IMAPS flash Conference 2025
✕
International Microelectronics and Packaging Society
About
For authors
Registration
Program
Sponsors
Last name - First name / Příjmení - Jméno
Company / Firma - University / Univerzita
Billing adress (VAT ID) / Fakturační adresa (IČO)
Registration type / Typ registrace
Speaker / Přednášející - 100 EUR / 2500 Kč
Speaker (IMAPS member) / IMAPS člen - Přednášející - 80 EUR / 2000 Kč
IMAPS member / IMAPS člen - Účastník - 50 EUR / 1200 Kč
Participant / Účastník - 60 EUR / 1500 Kč
Student (Conference paper) - 40 EUR / 1000 Kč
Student (Participant) - 40 EUR / 1000 Kč
Paper submission topics of interest
1.1 Thermal Modeling and Reliability Prediction in Power Modules
1.2 Electromagnetic Simulation for High-Speed and Optical Interconnects
1.3 Substrate and Dielectric Property Simulation for RF and Quantum Applications
1.4 Design of Electronic Circuits and Layouts for Advanced Packaging (Routing, power/signal integrity, parasitics, cross-domain co-design, EDA tools for heterogeneous integration)
2.1 Advanced Packaging in Automotive (ADAS, Powertrain, Safety Systems)
2.2 Packaging for AI, Edge, and HPC Systems
2.3 Photonic and Optical Packaging for Datacenters & Telecom
2.4 MEMS and Sensor Packaging in Biomedical and Industrial Systems
2.5 Quantum Devices and Systems (Qubit Control, Photonics, Cryo Integration)
2.6 Sustainable Electronics and Circular Economy Packaging
3.1 Chiplet & Interposer Technologies (2.5D/3D, RDL, TSV)
3.2 SiC / GaN Packaging and High-Power Integration
3.3 Thermal Management: TIMs, Spreaders, Heat Dissipation
3.4 Electrical Interconnects: Flip-Chip, Wirebond, Sintering
3.5 Optical Assembly and Co-Packaged Optics Technologies
3.6 High-Performance Substrates (ABF, Organic, Glass)
3.7 Failure Analysis and Reliability Testing (FIB, SAM, X-ray, HALT)
3.8 Cryogenic Packaging and Low-Temperature Materials
3.9 Eco-Friendly Materials and Low-Energy Manufacturing
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