The conferences organized by IMAPS Czech and Slovak Republic Chapter typically focus on current trends, challenges, and innovations in microelectronics, packaging technologies, and the manufacturing and protection of electronic assemblies. These events bring together professionals from academia, industry, and R&D to exchange knowledge, present new developments, and foster collaboration.

The IMAPS CZ a SK, as part of the international IMAPS organization, promotes the advancement of microelectronics and packaging technologies through conferences, workshops, and networking. It supports education, research, and the dissemination of technical knowledge in the fields of electronics manufacturing, design, materials, and reliability.

Topics from previous years:

• Trends in wireless technologies from the perspective of international distributors

• Design for manufacturability in modern electronics

• Improving the cleaning process of electronic assemblies through better design

• Corrosion protection of PCBs

• Application of XRF (X-ray fluorescence) in production control

• Hidden risks in the repair of long-lifecycle electronic systems

• High-precision measurement using FBG-based sensors

• New requirements for capacitors and passive components

• Verification of soldering in surface mount technology for space applications

• Current state and trends in EDA (Electronic Design Automation) software